I paiia huakai kaapuni a ka papa: hōʻikeʻano, inoa

Ke paiia huakai kaapuni a ka papa o ka mall hehee ai i ka loaʻa o ke dielectric kumu a me ke keleawe conductors, a i waihoia ma ka kūpapakū i loko o ka palapala o metallized pauku. Ua 'oi aku ka huina lakou o ka lolouila puni oihana mua.

Ka huakai kaapuni a ka papa i ka helu o ka pono e like me ka bulk (Hing) mea hoʻonoho hoʻohana uwea a me nā kaula:

• High paʻapū ai kaʻa hoʻi o ka Radio eiiiiiaiou a me kā lākou i huiʻia, kūpono ma me ka nui loa hoemiia ka nui a me ke kaumaha;
• loaa ana conductors a paleia lakou surfaces, a radioactive nā kumumea i loko o ka hoʻokahiʻanoʻenehana pōʻaiapuni;
• kumupaʻa, repeatability ano e like me capacitance, conductance, inductance;
• kiʻekiʻe mämä holo, a kani e hoʻonele circuitry;
• ia'ku i mechanical e, a climatic ololi;
• kūlanaʻano a me ka unification oʻanoʻenehana a me ka manao pāʻoihana;
• pono na aha halawai ona, huahelu, a me ka mea like me ka a pau;
• hou processability like me ka hopena o ka luna 'hana nona iho o kaʻaha kanaka ana, a me ka hooponopono o Ka hoʻololi' ana;
• haʻahaʻa hana pinepine ', nā hokii, a me na koina.

Ke paiia huakai kaapuni a ka papa i ua drawbacks, akā, ka mea mau loa i ka iki: kaupalena 'maintainability a me kiʻekiʻe ka manaʻo pohihihi o ka pepa manao hoʻololi.

Ke kumu o ia mau pepa loaʻa he dielectric kumu, he mea hao ka penaʻana, i mea he kumu o pai conductors, kūkā me nā pale poʻohiwi; hoʻopunipuni a me ka piʻiʻana lua.

Koi e pili ana i kēia mau huahana GOST

• I paiia huakai kaapuni a ka papa e loaʻa i ka homogeneous ano ma ka dielectric kūpapakū e e monolithic ma ka 'ole, mai i pihaʻi me na vesicles, e poholo, haole inclusions, mawae,? Inoaia, laulau. Naʻe ae hookahi scratches, metala inclusions, no kona wehe 'ana o ko läkou' neprotravlennogo hookahi hapa a me ka hōʻike 'ia nei o ka' ole a 'aʻole e hoʻololi i ka pou kiko'î a o ka huina hoonui, aole e emi i ka allowable mamao ma waena o ke kumu hehee wale.
• Ke Kii - akaka, me he ala apuupuu maka,ʻaʻohe blisters, mawae, kaha onionio, kumumea kila. Hōʻemi iki i nā kakou, akā,ʻaʻole oi aku mamua o elima heluʻai no huinahalike decimeter, a me ka proviso mea e hoʻopili like i ke koena o ka Track laula a hiki i ka palena iki allowable; crack lōʻihi i eono millimeters a me ka hohonu o ka 25 microns.

No ka hoʻoikaika 'ana i ka ka popopo hana ana a me ka hoʻoikaika solderability papa' ilikai kapa komo iā ia ma electrolytic haku mele 'ana a e e ana, me ka ihi, mai hemo mai a me ka podgarov. Hoʻopunipuni a me ka pono e hoolilo ka piʻiʻana lua o ka e like me ka unuhi. 'Ae' ia i ka haiahū kūmau hoakaka pololei ka papa uku. I mea e hoʻoikaika i ka pono o ka soldering ma luna o nā mea a pau ma loko surfaces o ka piʻiʻana luaʻawa keleawe, ahu iho, nona ka mānoanoa E e emi malalo o 25 microns. Kēia kaʻina ua kapaia - metallization o nā lua.

He aha ka PCB papa? Ma lalo o kēia manaʻo hoʻohuʻu papa miomio manufacturing kaapuni papa, ka mea i hoʻolako 'ia e GOST 23751-86. Ke kaumaha ma muli o ka kumu nuʻa o ka pai huakai kaapuni papa i elima papa o ka pololei, ka mea i waeia o ka i me ka nānā 'ana i ka oaoieei-lako a pan o ka hana pae. Ka mua a me ka lua o ka papa mai i koi miomio lako a pan, a ua manaoia nike i ka paka. Ke ha a me ka lima o ka papa i kauoha mai kūikawā mea, kūikawā pono, hemolele Hoʻomaʻemaʻe i? Iecaianoaaiiuo iiiauaiee, ea hoʻoikaika kino, ke ana wela i ka mana hoʻomalu. Wahi lulu hana nuipa ka hana i paiia kaapuni papa o ke kolu o ka papa o ka pololei.